Micromechanical detection structure of a MEMS multi-axis gyroscope, with reduced drifts of corresponding electrical parameters

ABSTRACT

A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

BACKGROUND Technical Field

The present disclosure relates to a micromechanical detection structure of a MEMS (Micro-Electro-Mechanical Systems) multi-axis gyroscope, which has reduced drifts of the corresponding electrical parameters in the presence of thermal deformations, or stresses of various nature acting from outside on a corresponding package.

Description of the Related Art

In particular, the following discussion will make explicit reference, without this implying any loss of generality, to a biaxial MEMS gyroscope having a sensing-mass arrangement subjected to sensing movements along a vertical axis z, i.e., in a direction orthogonal to a horizontal plane of main extension and to the top surface of a corresponding substrate (in addition, possibly, to being able to perform further sensing movements in the same horizontal plane).

It is known that micromechanical detection structures of MEMS sensors with vertical axis z are generally subject to drift of electrical parameters, due to the deformations of a corresponding substrate of semiconductor material, on account, for example, of thermal phenomena, mechanical stresses of various nature acting from outside on the package of the same sensors (for example, due to soldering to a printed-circuit board), or swelling due to humidity.

FIG. 1 shows a micromechanical structure 1 of a known type, of a MEMS sensor with vertical axis z (which further comprises an electronic reading interface, not illustrated, electrically coupled to the same micromechanical structure).

The micromechanical structure 1 comprises: a substrate 2 (including semiconductor material, for example, silicon); and a sensing mass 3, which is of conductive material, for example, polysilicon, and is arranged above the substrate 2, suspended at a certain distance from its top surface.

The sensing mass 3 has a main extension in a horizontal plane xy, which is defined by a first horizontal axis x and a second horizontal axis y that are mutually orthogonal and is substantially parallel to the top surface of the substrate 2 (in a resting condition, in the absence, that is, of external quantities acting on the micromechanical structure 1), and a substantially lower dimension along the vertical axis z, which is perpendicular to the aforesaid horizontal plane xy and which forms with the first and second horizontal axes x, y a set of three Cartesian axes xyz.

The sensing mass 3 has, at the center, a through opening 4, which traverses it throughout its thickness. This through opening 4 has in top plan view a substantially rectangular shape, which extends in length along the first horizontal axis x and is set at the centroid (or center of gravity) 0 of the sensing mass 3. The through opening 4 consequently divides the sensing mass 3 into a first portion 3 a and a second portion 3 b, arranged on opposite sides with respect to the same through opening 4 along the second horizontal axis y.

As illustrated schematically also in FIG. 2a , the micromechanical structure 1 further comprises a first fixed electrode 5 a and a second fixed electrode 5 b, of conductive material, which are arranged on the top surface of the substrate 2, on opposite sides with respect to the through opening 4 along the second horizontal axis y, to be positioned, respectively, underneath the first and second portions 3 a, 3 b of the sensing mass 3, at a respective distance of separation (or gap) Δz₁, Δz₂ (which, in resting conditions, have substantially the same value).

The first and second fixed electrodes 5 a, 5 b define, together with the sensing mass 3, a first sensing capacitor and a second sensing capacitor with plane and parallel faces, which are designated as a whole by C₁, C₂ and have a given value of capacitance at rest.

The sensing mass 3 is anchored to the substrate 2 by a central anchorage element 6, constituted by a pillar element, which extends within the through opening 4 starting from the top surface of the substrate 2, centrally with respect to the through opening 4. The central anchorage element 6 corresponds to the only point of constraint of the sensing mass 3 to the substrate 2.

In particular, the sensing mass 3 is mechanically connected to the central anchorage element 6 by a first elastic anchorage element 8 a and a second elastic anchorage element 8 b, which extend within the through opening 4, aligned, with a substantially rectilinear extension, along an axis of rotation A parallel to the first horizontal axis x, on opposite sides with respect to the central anchorage element 6. The elastic anchorage elements 8 a, 8 b are configured to be compliant to torsion about their direction of extension, thus enabling rotation of the sensing mass 3 out of the horizontal plane xy (in response to an external quantity to be detected, for example, an acceleration or an angular velocity).

Due to rotation, the sensing mass 3 approaches one of the two fixed electrodes 5 a, 5 b (for example, the first fixed electrode 5 a) and correspondingly moves away from the other of the two fixed electrodes 5 a, 5 b (for example, from the second fixed electrode 5 b), generating opposite capacitive variations of the sensing capacitors C₁, C₂.

Suitable interface electronics (not illustrated in FIG. 1) of the MEMS sensor, electrically coupled to the micromechanical structure 1, receives at input the capacitive variations of the sensing capacitors C₁, C₂, and processes these capacitive variations in a differential manner for determining the value of the external quantity to be detected.

The present Applicant has realized that the micromechanical structure 1 described previously may be subject to measurement errors in case the substrate 2 undergoes deformation.

The package of a MEMS sensor is in fact subject to deformation as the temperature varies, these deformation due to the different coefficients of thermal expansion of the materials of which it is made, causing corresponding deformations of the substrate 2 of the micromechanical structure 1 contained therein. Similar deformations may further occur on account of particular stresses induced from outside, for example, during soldering of the package on a printed-circuit board, or else on account of phenomena of swelling due to humidity.

As illustrated schematically in FIG. 2b , due to the deformations of the substrate 2, the fixed electrodes 5 a, 5 b, which are directly constrained thereto (these electrodes are in general set on the top surface of the substrate 2), follow the same deformations of the substrate, while the sensing mass 3 moves, following the displacements of the central anchorage element 6.

Deformation of the substrate 2 may cause both a variation, or drift, of static offset (at time zero) or of the so-called output in response to a zero input (ZRL—Zero-Rate Level), i.e., of the value supplied at output in the absence of quantities to be detected (for example, in the absence of an angular velocity acting from the outside), and a variation of sensitivity in the detection of quantities.

In the example illustrated, the substrate 2 and the corresponding top surface undergo a deformation along the vertical axis z with respect to the second horizontal axis y (in the example, a bending), and, due to this deformation, variations occur in the average distances (or gaps) Δz₁ and Δz₂ that separate the sensing mass 3 from the substrate 2 at the first and second fixed electrodes 5 a, 5 b.

The aforesaid variations of distance cause corresponding variations of the capacitance of the sensing capacitors C₁, C₂ that are not linked to the quantity to be detected and thus cause undesired variations of the sensing performance of the micromechanical structure 1.

In particular, in the case where the deformation of the substrate 2 causes substantially equal variations of the gaps Δz₁ and Δz₂, a variation of the sensitivity of detection of the micromechanical structure 1 occurs (understood as ratio ΔC/Δz). In the case of differential variation of the gaps Δz₁ and Δz₂, a capacitive offset at time zero occurs and/or a variation of the ZRL during operation of the MEMS sensor.

To overcome the above drawbacks, solutions have been proposed, designed in general to eliminate, or at least reduce, the effects of the deformations of the substrate 2 on the micromechanical structure 1.

For instance, document No. US 2011/0023604 A1, filed in the name of the present Applicant, describes a micromechanical detection structure for a MEMS inertial accelerometer with a single sensing axis (the vertical axis z), which has reduced drifts.

In brief, this solution basically envisages anchorage of the sensing mass of the micromechanical structure at anchorages (or points of constraint to the substrate) set in the proximity of the fixed electrodes. In this way, deformations of the substrate affect in a substantially similar way the position of the fixed electrodes and the arrangement of the sensing mass, minimizing the effects of these deformations.

The solution described in the aforesaid document US 2011/0023604 A1 refers, however, only to a micromechanical structure of a uniaxial inertial accelerometer. In particular, there is no reference to how the solution described may be adopted in more complex detection structures, such as, for example, that of a multi-axis MEMS gyroscope in which it is necessary to co-ordinate multiple driving and sensing movements, without altering the characteristics of the same movements.

In a known way, MEMS gyroscopes operate on the principle of relative accelerations, exploiting Coriolis acceleration. When an angular velocity is applied to a moving mass of a corresponding micromechanical detection structure, which is driven in a linear direction, the mobile mass “feels” an apparent force, or Coriolis force, which causes a displacement thereof in a direction perpendicular to the linear driving direction and to the axis about which the angular velocity is applied. The mobile mass is supported above a substrate via elastic elements that enable driving thereof in the driving direction and displacement in the direction of the apparent force, which is directly proportional to the angular velocity and may, for example, be detected via a capacitive transduction system.

BRIEF SUMMARY

The present disclosure provides a micromechanical structure of a multi-axis MEMS gyroscope having reduced drift of its electrical parameters, for example in terms of output signal in response to a zero input (ZRL) and of in terms of sensitivity, in the presence of deformations of the corresponding substrate.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a better understanding of the present disclosure, a preferred embodiment thereof is now described, purely by way of non-limiting example and with reference to the attached drawings, wherein:

FIG. 1 is a top plan view of a micromechanical structure of a MEMS sensor with vertical axis z, of a known type;

FIG. 2a is a cross-sectional view of the micromechanical structure of FIG. 1a , taken along the line II-II of FIG. 1;

FIG. 2b is a cross-sectional view, similar to that of FIG. 2a , in the presence of a deformation of the substrate of the micromechanical structure;

FIG. 3 is a schematic top plan view of a micromechanical detection structure of a multi-axis MEMS gyroscope according to a first embodiment of the present disclosure;

FIG. 4a is a cross-sectional view of the micromechanical structure of FIG. 3, taken along the line IV-IV of FIG. 3;

FIG. 4b is a cross-sectional view similar to that of FIG. 4a , in the presence of a deformation of the substrate of the micromechanical structure;

FIG. 5 is a schematic top plan view of a micromechanical detection structure of a multi-axis MEMS gyroscope according to a second embodiment of the present disclosure;

FIG. 6 is a general block diagram of an electronic device incorporating the MEMS gyroscope of FIG. 3 or 5 according to a further aspect of the present disclosure; and

FIG. 7 shows an embodiment of a sensing electrode of the micromechanical structure of the MEMS gyroscope of FIG. 3 or 5 according to a possible variant embodiment of the present disclosure.

DETAILED DESCRIPTION

FIG. 3 is a schematic illustration of a first embodiment of a micromechanical detection structure of a multi-axis MEMS gyroscope, designated as a whole by 10, provided in a body (die) of semiconductor material, for example, silicon, including a substrate 12.

The micromechanical structure 10 has a substantially planar configuration with main extension in the horizontal plane xy, and minor dimension, as compared to the aforesaid main extension, in a direction parallel to the vertical axis z.

The micromechanical structure 10 comprises a first driving mass 14 a and a second driving mass 14 b, with extension in the horizontal plane xy (purely by way of example, substantially rectangular) and connected to respective anchorages 15 a, 15 b, fixed with respect to the substrate 12, by respective elastic anchorage elements 16 a, 16 b.

A respective set of driving electrodes 17 a, 17 b is associated with each driving mass 14 a, 14 b. Each set of driving electrodes 17 a, 17 b comprises: a respective plurality of mobile electrodes 18 a, 18 b, which are fixed with respect to the respective driving mass 14 a, 14 b and extend outside the driving mass 14 a, 14 b; and a respective plurality of fixed electrodes 19 a, 19 b, fixed with respect to the substrate 12 and comb-fingered to the mobile electrodes 18 a, 18 b.

Suitable electrical biasing signals from an electronic circuit (here not illustrated) for driving the MEMS gyroscope, determine, by mutual and alternating electrostatic attraction of the electrodes, an oscillatory driving movement of the driving masses 14 a, 14 b in a linear driving direction, in the example, along the second horizontal axis y. In particular, the first and second driving masses 14 a, 14 b are driven in opposite senses of this driving direction, as indicated by the arrows in FIG. 3. The elastic anchorage elements 16 a, 16 b are thus configured to be compliant with respect to this driving movement.

The micromechanical structure 10 further comprises a driven mass 20, set between the first and second driving masses 14 a, 14 b (in the direction of the first horizontal axis x) and connected to the same driving masses 14 a, 14 b by elastic connection elements 21 a, 21 b.

The driven mass 20 is suspended above the substrate 12, parallel thereto in a resting condition (i.e., in the absence of quantities to be detected).

The driven mass 20 has a main extension in the horizontal plane xy, with a shape that is, for example, rectangular, and a central window 22 (or through opening) that centrally defines an empty space, the center O of which coincides with the centroid and the center of symmetry of the entire micromechanical structure 10.

A coupling assembly 24 is arranged within the central window 22 and, according to a particular aspect of the present solution, is configured for anchorage of the driven mass 20 to the substrate 12.

In particular, the coupling assembly 24 comprises a pair of rigid elements 25 a, 25 b, which in the example have a rectilinear extension along the second horizontal axis y, arranged centrally to the central window 22, symmetrically with respect to the second horizontal axis y.

The aforesaid rigid elements 25 a, 25 b are, for example, formed via chemical etching of the same layer of material (for example, polysilicon), during the same process step as that in which the driven mass 20 is obtained.

Each rigid element 25 a, 25 b is elastically connected to the driven mass 20 by a respective elastic connection element 26 a, 26 b, which extends in the central window 22 starting from a central portion of the respective rigid element 25 a, 25 b as far as a facing side of the driven mass 20 (which defines the central window 22). The elastic connection elements 26 a, 26 b are, in the example illustrated in FIG. 3, aligned with a substantially rectilinear extension, along the first horizontal axis x, on opposite sides with respect to the center O (different embodiments for the elastic connection elements 26 a, 26 b may, however, be envisaged, for example, having an “L” shape).

The elastic connection elements 26 a, 26 b are configured to be compliant to torsion about their direction of extension, enabling, in this embodiment, rotation of the driven mass 20 out of the horizontal plane xy (as described in detail hereinafter), about the axis of rotation defined by the same elastic connection elements 26 a, 26 b.

Furthermore, each rigid element 25 a, 25 b is connected, at respective terminal ends, to anchorage elements 27, set in contact with, and on top of, the substrate 12, fixed with respect thereto (for example, being constituted by column elements, which extend vertically starting from the substrate 12), by respective elastic decoupling elements 28.

In the embodiment illustrated in FIG. 3, the elastic decoupling elements 28 have a linear extension along the first horizontal axis x, and a length smaller than that of the elastic connection elements 26 a, 26 b. Furthermore, the anchorage elements 27 are set, within the central window 22, according to appropriate criteria that will be clarified in what follows.

The rigid elements 25 a, 25 b are configured to have a high stiffness as compared to the elastic connection elements 26 a, 26 b and to the elastic decoupling elements 28. The extension of these rigid elements 25 a, 25 b is, in the absence of deformations of the substrate 12, to be considered as lying in the horizontal plane xy. In other words, their value of stiffness is such that that the rigid elements 25 a and 25 b may reasonably be considered as rigid bodies, even in the presence of maximum tolerable deformations of the substrate 12.

Each elastic decoupling element 28 is configured, together with the respective anchorage element 27 to define an element of constraint of the hinge type with respect to the substrate 12. In addition, the elastic decoupling elements 28 have a much higher stiffness than the elastic connection elements 26 a, 26 b, so that the rigid elements 25 a, 25 b may be considered as substantially immobile with respect to the driven mass 20, during motion of the structure, whether it is a driving motion or a sensing motion (as described in greater detail hereinafter).

The micromechanical structure 10 further comprises: a first pair of sensing electrodes 29 a, 29 b, arranged on the substrate 12 and fixed with respect thereto, underneath the driven mass 20, on opposite sides of the central window 22 along the first horizontal axis x; and moreover a second pair of sensing electrodes 30 a, 30 b, arranged on the same substrate 12 and fixed with respect thereto, underneath the driven mass 20, on opposite sides with respect to the central window 22 along the second horizontal axis y.

In particular, according to one aspect of the present solution, the anchorage elements 27 are arranged, in pairs, in a position corresponding to, and in the proximity of, a respective sensing electrode 29 a, 29 b, 30 a, 30 b.

In general, at least one point of constraint (defined by a respective anchorage element 27 and elastic decoupling element 28) of the driven mass to the substrate 12 is provided in a position corresponding to each sensing electrode 29 a, 29 b, 30 a, 30 b. In the example illustrated in FIG. 3, four points of constraint are, for example, provided, two of which are arranged at the sensing electrode 30 a, and the other two are arranged at the sensing electrode 30 b, in a way substantially symmetrical with respect to the center O of the central window 22 (likewise, a first pair of points of constraint is set at the sensing electrode 29 a, and a second pair of points of constraint is set at the sensing electrode 29 b).

During operation, the coupling assembly 24 is configured to allow a rotation of the driven mass 20 in the horizontal plane xy (with respect to the substrate 12) about the vertical axis z, in response to the driving movement in opposite senses of the driving masses 14 a, 14 b (as represented by the arrows). Basically, the driven mass 20 is driven in rotation (in the example, in the counterclockwise direction) by the movement of the driving masses 14 a, 14 b, to generate tangential forces on the driven mass 20 itself, in particular directed along the first horizontal axis x, in opposite senses, at the sensing electrodes 30 a, 30 b.

In response to this driving movement of the driving masses 14 a, 14 b, and in the presence of an angular velocity about the first horizontal axis x, designated by ω_(x), a couple of Coriolis forces is generated on the driven mass 20, having direction along the vertical axis z and opposite senses, and thus causing a respective rotation out of the horizontal plane xy, in the example about the second horizontal axis y.

The sensing electrodes 29 a, 29 b enable, by capacitive coupling, the detection of a quantity indicative of the value of the aforesaid angular velocity ω_(x) about the first horizontal axis x (which thus represents a first sensing axis for the MEMS gyroscope).

In the presence of an angular velocity about the second horizontal axis y, designated by ω_(y), Coriolis forces on the driven mass 20 directed along the vertical axis z are further generated (in opposite senses, at the sensing electrodes 30 a, 30 b), which cause a rotation thereof out of the horizontal plane xy, in the example about the axis of rotation defined by the elastic connection elements 26 a, 26 b, in a direction parallel to first horizontal axis x.

The sensing electrodes 30 a, 30 b enable, by capacitive coupling with the driven mass 20, detection of an electrical quantity indicative of the value of the aforesaid angular velocity ω_(y) about the second horizontal axis y (which thus represents a second sensing axis for the MEMS gyroscope).

As shown schematically in FIG. 4a (which represents a condition at rest) and in FIG. 4b (which represents a condition of deformation of the substrate 12), in the presence of deformations of the substrate 12, the arrangement of the anchorage elements 27, in the example at the sensing electrodes 30 a, 30 b, advantageously enables reduction of the mean value of variations Δz₁ and Δz₂, with respect to the resting condition, of the gaps that separate the driven mass 20 (in this case acting also as sensing mass) from the sensing electrodes 30 a, 30 b. These gaps have substantially corresponding variations Δz₁ and Δz₂, which do not differ considerably from one another.

Furthermore, the elastic decoupling elements 28 advantageously enable reduction of the mean value of inclination of the driven mass 20 with respect to the substrate 12, absorbing and compensating, in fact, possible stresses and rotations of the substrate 12 at the anchorage elements 27.

Consequently, any undesired variation of the electrical detection parameters of the micromechanical structure 10 (for example, in terms of ZRL and sensitivity) is prevented.

In greater detail, in the presence of a displacement of the substrate 12 (and, therewith, of the sensing electrodes 30 a, 30 b) along the vertical axis z, due, for example, to a deformation as a function of temperature, the points of constraint shift along the vertical axis z, substantially in a manner corresponding to the fixed electrodes 30 a, 30 b, and similar displacements are transmitted to the rigid elements 25 a, 25 b by the elastic decoupling elements 28. Due to such displacements, the rigid elements 25 a, 25 b move, setting themselves in a plane that interpolates the new positions assumed by the points of constraint. In particular, the errors between the interpolated plane and the positions of the individual points of constraint are compensated by the deformations of the elastic decoupling elements 28, which further compensate any possible expansion of the substrate 12.

Given the stiffness of the elastic decoupling elements 28, the driven mass 20 follows directly the displacement of the rigid elements 25 a, 25 b, setting itself accordingly in space. In other words, the driven mass 20 is rigidly connected to the rigid elements 25 a, 25 b in following the deformations of the substrate 12 along the orthogonal axis z.

Consequently, the driven mass 20 also undergoes a displacement substantially corresponding to the displacement of the fixed electrodes 30 a, 30 b, thus in effect reducing the (mean) variation of the gaps Δz₁ and Δz₂ between the driven mass 20 and the fixed electrodes 30 a, 30 b, with the result that no appreciable changes occur in the values of sensitivity and offset at output from the MEMS gyroscope.

The arrangement of the points of constraint in the proximity of the fixed electrodes 30 a, 30 b is thus per se advantageous in so far as it causes the driven mass 20 to undergo displacements that may be approximated to the mean displacements of the same fixed electrodes 30 a, 30 b, thus reducing the drifts in the electrical values at output from the MEMS gyroscope. In particular, using a mathematical modelling of the micromechanical structure 10, it is advantageously possible to determine the optimal specific position of the points of constraint (and of the corresponding anchorage elements 27) such as to effectively minimize the mean variation of the gaps Δz₁ and Δz₂ between the driven mass 20 and the fixed electrodes 30 a, 30 b (similar considerations apply, of course, to the fixed electrodes 29 a, 29 b).

For instance, it is possible to use an iterative procedure to determine, in the stage of design and manufacturing of the micromechanical structure 10, a best position of the points of constraint enabling minimization of the drifts of sensitivity and offset of the sensor in the presence of deformation of the substrate 12.

With reference to FIG. 5, a description is presented of a second embodiment of a micromechanical detection structure of a multi-axis MEMS gyroscope, designated once again by 10 (in general, elements that are similar to others illustrated previously are designated by the same reference numbers and are not described herein again in detail).

In this embodiment, the driven mass 20 is again driven in its movement of rotation about the vertical axis z by the first and second driving masses 14 a, 14 b (in a way altogether similar to what has been described previously with reference to FIG. 3), to which it is once again connected by the elastic connection elements 21 a, 21 b.

In the driven mass 20, once again as described previously, the central opening 22 defines the empty space in which the coupling assembly 24 is located (provided in a way altogether similar to what has been described previously).

In this case, the driven mass 20 further has two further pairs of windows (or through openings), provided therein, laterally with respect to the central window 22, namely: a first pair of lateral windows 32 a, 32 b, set on opposite sides of the central window 22, aligned along the first horizontal axis x; and a second pair of lateral windows 33 a, 33 b, set on opposite sides of the central window 22, aligned along the second horizontal axis y.

The micromechanical structure 10 in this case comprises further and distinct sensing masses, which are designed for detecting angular velocities along the horizontal axes x, y, and are set within the aforesaid lateral windows. Neither the driven mass 20 nor the driving masses 14 a, 14 b have in this case the function of detecting angular velocities (and are not capacitively coupled to sensing electrodes).

In detail, the micromechanical structure 10 comprises a first pair of sensing masses 35 a, 35 b, each set within a respective lateral window 32 a, 32 b of the first pair, suspended above the substrate 12 and connected to the driven mass 20 by elastic suspension elements 36.

In particular, the elastic suspension elements 36, of a torsional type, extend parallel to the second horizontal axis y, on opposite sides of a terminal portion of the respective sensing mass 35 a, 35 b, which is arranged in the proximity of the central window 22 so that the same sensing masses 35 a, 35 b are set in cantilever fashion above the substrate 12, i.e., with a corresponding centroid set at an appropriate distance from the axis of rotation constituted by the elastic suspension elements 36.

During operation, in the presence of an angular velocity about the first horizontal axis x (angular velocity ωx), a Coriolis force is generated on the sensing masses 35 a, 35 b directed along the vertical axis z, which causes a respective rotation thereof out of the horizontal plane xy, about the axis of rotation defined by the aforesaid elastic suspension elements 36, in opposite senses of the same vertical axis z.

Conveniently, the sensing electrodes 29 a, 29 b are in this case provided on the substrate 12 underneath the sensing masses 35 a, 35 b. In addition, the anchorage elements 27 coupled to the rigid elements 25 a, 25 b of the coupling assembly 24 are in this case set in the proximity of these sensing electrodes 29 a, 29 b.

The micromechanical structure 20 further comprises a second pair of sensing masses 37 a, 37 b, each set within a respective lateral window 33 a, 33 b of the second pair, suspended above the substrate 12 and connected to the driven mass 20 by respective elastic suspension elements 38.

During operation, in the presence of an angular velocity about the second horizontal axis y (angular velocity ω_(y)), Coriolis forces are generated on the sensing masses 37 a, 37 b directed in opposite senses along the vertical axis z, which cause a respective rotation thereof out of the horizontal plane xy, about an axis of rotation, parallel to the first horizontal axis x, passing through the points of coupling with the aforesaid elastic suspension elements 38.

The sensing electrodes 30 a, 30 b, set on the substrate 12 underneath the sensing masses 37 a, 37 b, enable, by capacitive coupling with the sensing masses 37 a, 37 b, detection of a quantity indicative of the value of angular velocity ω_(y).

The anchorage elements 27 coupled to the rigid elements 25 a, 25 b of the coupling assembly 24 are in this case set also in the proximity of the aforesaid sensing electrodes 30 a, 30 b.

Thus, in a way altogether similar to what has been discussed with reference to the first embodiment of FIG. 3, the coupling assembly 24 of the micromechanical structure 10 enables effective compensation of possible deformations of the substrate 12 and reduction and minimization of drifts of the electrical parameters for detection of the angular velocity.

The advantages of the solutions proposed emerge clearly from the foregoing description.

In any case, it is once again underlined that the micromechanical detection structure 10 of the MEMS gyroscope is substantially insensitive to deformations of the substrate (for example, due to temperature variations, external stresses, such as the ones due to soldering to a printed-circuit board or to the presence of humidity). The variations of offset and sensitivity as a function of the deformations of the substrate are in fact extremely low (substantially zero), thus minimizing in general the drifts of the electrical parameters.

In particular, thanks to the solution described, these effects are advantageously achieved without affecting in any way the movements of driving and sensing of the angular velocities envisaged in the MEMS gyroscope.

The solutions described for anchorage and support of the driven mass 20 with respect to the substrate 12 do not entail any substantial modification as regards the modalities of detection of the angular velocities and general operation of the MEMS gyroscope.

Advantageously, the micromechanical structure 10 further has overall dimensions comparable to those of traditional solutions (i.e., ones that envisage a single central anchorage).

The second embodiment, illustrated with reference to FIG. 5, may further provide specific advantages as compared to the first embodiment, in so far as it enables higher sensitivity values, a lower effect of disturbance between the two axes of angular velocity detection (as regards the so-called “cross-axis sensitivity”), and also a greater effect of rejection of disturbance linked to deformations of the substrate 12 (in this second embodiment, the anchorage elements 27 are set in proximity to the sensing electrodes 29 a-29 b, 30 a-30 b associated with both of the sensing axes).

In any case, use of the micromechanical structure 10 and of the corresponding MEMS gyroscope is particularly advantageous in an electronic device 40 of a portable or wearable type, as illustrated schematically in FIG. 6.

In particular, in this FIG. 6, the MEMS gyroscope is designated by 42, and includes the micromechanical structure 10 previously described and an ASIC 43, which provides the corresponding reading interface (and may be provided in the same die as that of the micromechanical structure 10 or in a different die, which may in any case be housed in a same package).

The electronic device 40 is preferably a mobile-communication portable device, such as a cellphone, a PDA (Personal Digital Assistant), a portable computer, but also a digital audio player with voice-recording capacity, a photographic camera or video camera, a controller for video games, etc.; the electronic device 40 may further be a wearable device, such as a watch or bracelet.

The electronic device 40 is generally able to process, store, and/or transmit and receive signals and information, and comprises: a microprocessor 44, which receives the signals detected by the MEMS gyroscope 42; and an input/output interface 45, for example, provided with a keypad and a display, coupled to the microprocessor 44. Furthermore, the electronic device 40 may comprise a speaker 47, for generating sounds on an audio output (not illustrated), and an internal memory 48.

Finally, it is clear that modifications and variations may be made to what has been described and illustrated herein, without thereby departing from the scope of the present disclosure, as defined in the annexed claims.

For instance, the number of points of constraint with which the driven mass 20 is mechanically coupled to the substrate 12 could vary with respect to what has been illustrated, being possible to use a smaller or greater number thereof. Of course, the use of a number of points of constraint of less than four entails a progressive reduction of the capacity of compensation of the deformations of the substrate 12, whereas the use of a greater number of points of constraint, albeit enabling greater compensation of the deformations, entails a greater complexity of the micromechanical structure 10.

The number of sensing electrodes could vary with respect to what has been illustrated; a greater number of electrodes may in fact be present (for example, shorted with respect to one another according to appropriate electrode arrangements, that are to form, as a whole, the two sensing capacitors C₁, C₂ with corresponding sensing masses), or else even just one sensing electrode in the case where a differential sensing scheme is not adopted.

Furthermore, as illustrated in the detail of FIG. 7, each sensing electrode 29 a-29 b, 30 a-30 b (the figure illustrates by way of example just the sensing electrode 30 a) may be shaped so as to include within its overall dimensions, or envelope region, in the horizontal plane xy, a base portion of the respective anchorage elements 27 for further reducing the effects associated with the deformations of the substrate 12.

In this case, each sensing electrode has recesses designed to house at least partially a base portion of a corresponding anchorage element 27, which is coupled to the substrate 12. Likewise, the central window 22 has corresponding extensions above the sensing electrodes.

Finally, it is clear that the solution described may be advantageously applied also to further types of MEMS sensors, for example, triaxial gyroscopes capable of detecting angular velocities also about a third sensing axis (the so-called angular velocities of yaw), which in this case comprise a further sensing-mass arrangement (in a way here not discussed in detail).

The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments in light of the above-detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the disclosure. 

The invention claimed is:
 1. A method, comprising: forming driving-masses over a surface of a semiconductor substrate; forming a driven-mass over the surface of the semiconductor substrate, the driven-mass including a through hole extending through the driven-mass; elastically coupling the driving-masses to the driven-mass; forming a plurality of sensing electrodes on the surface of the semiconductor substrate, the plurality of sensing electrodes being positioned around a periphery of the through hole of the driven-mass, the plurality of sensing electrodes being configured to be capacitively coupled to the driven-mass; forming a plurality of anchorage elements within the through hole of the driven-mass and on the surface of the semiconductor substrate, each anchorage element being proximate a corresponding one of the plurality of sensing electrodes; forming a rigid structure within the through hole of the driven-mass and over the semiconductor substrate; coupling a central portion of the rigid structure to the driven-mass; and coupling end portions of the rigid structure to the plurality of anchorage elements.
 2. The method of claim 1 wherein coupling the central portion of the rigid structure to the driven-mass includes coupling elastic connection elements between the central portion of the rigid structure and the driven-mass.
 3. The method of claim 1 wherein coupling end portions of the rigid structure to the plurality of anchorage elements includes coupling each end portion of the rigid structure to a corresponding anchorage element through an elastic decoupling element.
 4. The method of claim 1 wherein forming the plurality of anchorage elements on the surface of the semiconductor substrate includes forming each anchorage element on the semiconductor substrate within an envelope region of a corresponding of the plurality of sensing electrodes.
 5. The method of claim 1 wherein the plurality of anchorage elements are positioned around the periphery of the through hole of the driven-mass.
 6. A method, comprising: forming a first plurality of electrodes on a substrate; forming a first mass that is aligned with the first plurality of electrodes; forming a hole in the first mass, the hole extending through the first mass; and forming a coupling assembly that is aligned with the hole, the forming of the coupling assembly including: forming a first plurality of anchorage elements on the substrate; forming a plurality of rigid elements; coupling the plurality of rigid elements and the first plurality of anchorage elements to each other with a first plurality of elastic elements; and coupling the plurality of rigid elements to the first mass with a second plurality of elastic elements; forming a second mass; forming a second plurality of anchorage elements on the substrate; coupling the second mass and the second plurality of anchorage elements to each other with a third plurality of elastic elements; forming a third mass, the first mass positioned between the second mass and the third mass; forming a third plurality of anchorage elements on the substrate; and coupling the third mass and the third plurality of anchorage elements to each other with a fourth plurality of elastic elements.
 7. The method of claim 6, further comprising: forming a second plurality of electrodes that are coupled to the second mass; and forming a third plurality of electrodes that are coupled to the substrate.
 8. The method of claim 7 wherein at least one electrode of the third plurality of electrodes is positioned between two electrodes of the second plurality of electrodes.
 9. The method of claim 6 wherein the first mass is configured to rotate around an axis extending in a first direction, the first mass being aligned with the first plurality of electrodes in the first direction.
 10. A method, comprising: forming a first plurality of electrodes on a substrate; forming a driven-mass that directly overlies the substrate; forming a first through hole that extends through the driven-mass; forming a first plurality of anchorage elements on the substrate, the first through hole directly overlies the first plurality of anchorage elements; forming a plurality of rigid elements, the first through hole directly overlies the plurality of rigid elements; and elastically coupling the plurality of rigid elements to the first plurality of anchorage elements and the driven-mass.
 11. The method of claim 10, further comprising: forming a second through hole, a third through hole, a fourth through hole, and a fifth through hole that extend through the driven-mass.
 12. The method of claim 11 wherein the first through hole is positioned between the second through hole and the third through hole, and is positioned between the fourth through hole and the fifth through hole.
 13. The method of claim 12 wherein the first through hole, the second through hole, and the third through hole are positioned between the fourth through hole and the fifth through hole.
 14. The method of claim 11, further comprising: forming a first sensing mass that is aligned with the second through hole; forming a second sensing mass that is aligned with the third through hole; forming a third sensing mass that is aligned with the fourth through hole; and forming a fourth sensing mass that is aligned with the fifth through hole, each of the first, second, third, and fourth sensing masses directly overlies a respective electrode of the first plurality of electrodes.
 15. The method of claim 14, further comprising: elastically coupling the first sensing mass, the second sensing mass, the third sensing mass, and the fourth sensing mass to the driven-mass.
 16. The method of claim 10, further comprising: forming a second plurality of anchorage elements on the substrate; forming a first driving mass; and elastically coupling the first driving mass to the second plurality of anchorage elements.
 17. The method of claim 16, further comprising: forming a third plurality of anchorage elements on the substrate; forming a second driving mass; and elastically coupling the second driving mass to the third plurality of anchorage elements, driven-mass positioned between the first driving mass and the second driving mass.
 18. The method of claim 16, further comprising: forming a second plurality of electrodes that are coupled to the first driving mass; and forming a third plurality of electrodes that are coupled to the substrate.
 19. The method of claim 14 wherein the first through hole is aligned with the second through hole and the third through hole in a first direction, and is aligned with the fourth through hole and the fifth through hole in a second direction transverse to the first direction.
 20. The method of claim 19 wherein each of the second, third, fourth, and fifth through holes has a first dimension extending in the first direction and a second dimension extending in the second, the first dimensions of the second and third through holes is smaller than the first dimensions of the fourth and fifth through holes. 